M2S050TS-1FGG896
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 896-BGA |
| Supplier Device Package | 896-FBGA (31x31) |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 377 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 50K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.There is a 896-BGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series number of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 50K Logic Modules.Tray package houses this SoC system on a chip.377 I/Os are included in this SoC part.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-1FGG896 System On Chip (SoC) applications.
- Wireless sensor networks
- PC peripherals
- Industrial AC-DC
- POS Terminals
- Measurement testers
- ARM support modules
- Digital Signal Processing
- Industrial automation devices
- ARM Cortex M4 microcontroller
- DC-input BLDC motor drive
