Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
400-LFBGA |
Supplier Device Package |
400-VFBGA (17x17) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
207 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 50K Logic Modules |
Flash Size |
256KB |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.Housed in the state-of-art Tray package.207 I/Os are included in this SoC part.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-1VF400 System On Chip (SoC) applications.
- Industrial transport
- String inverter
- Samsung galaxy gear
- External USB hard disk/SSD
- Video Imaging
- Industrial Pressure
- Functional safety for critical applications in the industrial sectors
- Mobile market
- Central alarm system
- High-end PLC