M2S050TS-FCSG325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series SmartFusion?2.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 50K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 200 I/Os.Use a power supply with a voltage of 1.2V if possible.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.A system on a chip benefits from having 325 terminations.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 200 outputs.There is 1.2V power supply requirement for this system on chip SoC.200 inputs are available on the SoC chip.A logic SoC has 56340 logic cells.A flashing 256KB appears on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050TS-FCSG325 System On Chip (SoC) applications.
- Smart appliances
- Optical drive
- Samsung galaxy gear
- Medical
- Remote control
- Automated sorting equipment
- Cyberphysical system-on-chip
- Networked sensors
- Efficient hardware for inference of neural networks
- Digital Signal Processing
