Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
896-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
896 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B896 |
Number of Outputs |
377 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
377 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
377 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 50K Logic Modules |
Number of Logic Cells |
56340 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 896-BGA, this system on a chip comes from the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 50K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.377 I/Os in total are included in this SoC part.A power supply with a 1.2V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.At least 1.14V can be supplied as a power source.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 896 terminations, which makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 377 outputs is available.There is 1.2V power supply required for system on chip.The SoC chip offers 377 inputs.56340 logic cells are included in logic system on chips.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-FG896I System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- Vending machines
- Keywords
- Robotics
- Smart appliances
- Multiprocessor system-on-chips (MPSoCs)
- Servo drive control module
- Microprocessors
- Medical Pressure
- sequence controllers