M2S060-1FCSG325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.An advanced Tray package houses this SoC system on a chip.200 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 325 terminations, which is great for system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 200 outputs, which is convenient.There is 1.2V power supply required for system on chip.There are 200 inputs available on the SoC chip.56520 logic cells are present in logic system on chips.The flash is set to 256KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060-1FCSG325 System On Chip (SoC) applications.
- High-end PLC
- Level
- Flow Sensors
- Networked sensors
- Digital Media
- Microcontroller based SoC ( RISC-V, ARM)
- ARM Cortex M4 microcontroller
- Measurement testers
- Central alarm system
- Vending machines
