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M2S060-1FG484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S060-1FG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 813
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 267 I/Os.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.Power supply should be at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 484 terminations, which makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 267 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.A SoC chip with 267 inputs is available.Logic system on chips features 56520 logic cells.A flashing 256KB appears on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060-1FG484 System On Chip (SoC) applications.

  • Temperature Sensors
  • Industrial sectors
  • PC peripherals
  • Flow Sensors
  • Servo drive control module
  • Communication interfaces ( I2C, SPI )
  • Cyberphysical system-on-chip
  • Fitness
  • Smartphone accessories
  • ARM Cortex M4 microcontroller

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