M2S060-1FG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.This system on a chip is packaged as 676-BGA by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines FPGA - 60K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.387 I/Os are available in this SoC part.It is recommended to use a 1.2V power supply.There is no safe voltage for the SoCs wireless above 1.26V.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.As a result, there are 676 terminations in total, which does really benefit system on a chip.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 387 outputs.There is 1.2V power supply required for system on chip.The SoC chip is equipped with 387 inputs.There are 56520 logic cells in the logic system on chips.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-1FG676 System On Chip (SoC) applications.
- Wireless networking
- Apple smart watch
- Communication interfaces ( I2C, SPI )
- External USB hard disk/SSD
- Healthcare
- Robotics
- Self-aware system-on-chip (SoC)
- Transmitters
- POS Terminals
- Central alarm system
