M2S060-1FG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 60K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 676-BGA to this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 387.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-1FG676I System On Chip (SoC) applications.
- Functional safety for critical applications in the aerospace
- DC-input BLDC motor drive
- Networked Media Encode/Decode
- Central inverter
- Digital Signal Processing
- Multiprocessor system-on-chips (MPSoCs)
- Optical drive
- Personal Computers
- Fitness
- Mobile market
