M2S060-1FGG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.It has been assigned a package 676-BGA by its manufacturer for this system on a chip.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As long as it receives a power supply that is at least 1.14V, it should be able to function.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 676 terminations, which makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.This SoC chip is capable of having 387 outputs, which is convenient.This system on chip SoC requires 1.2V power supply at all.This SoC chip is equipped with 387 inputs for the user to choose from.Logic system on chips features 56520 logic cells.There is a flash of 256KB on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-1FGG676 System On Chip (SoC) applications.
- Automated sorting equipment
- Measurement tools
- Mouse
- Keywords
- Central inverter
- Industrial Pressure
- POS Terminals
- Microcontroller based SoC ( RISC-V, ARM)
- Medical Pressure
- Healthcare
