M2S060-FCS325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Number of Pins | 325 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Supply Voltage-Max (Vsup) | 1.26V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion?2 is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 200 I/Os.A 1.2V power supply should be used.There is no safe voltage for the SoCs wireless above 1.26V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.A system on a chip benefits from having 325 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.It is possible to use this SoC chip with 200 outputs.System on chips of logic are comprised of 56520 logic cells.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.In this computer SoC, there are 325 pins.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060-FCS325I System On Chip (SoC) applications.
- Industrial robot
- Cyber security for critical applications in the aerospace
- Sensor network-on-chip (sNoC)
- Smart appliances
- Industrial sectors
- Central alarm system
- Healthcare
- Automated sorting equipment
- Measurement testers
- Industrial transport
