M2S060-FCSG325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 200 I/Os.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.There are 325 terminations in total and that really benefits system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 200 outputs.This system on chip SoC requires 1.2V power supply at all.Inputs are available on the SoC chip in the number of 200.In logic system on chips, there are 56520 logic cells.There is a flash of 256KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060-FCSG325 System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- Smart appliances
- Self-aware system-on-chip (SoC)
- Smart appliances
- Optical drive
- Communication interfaces ( I2C, SPI )
- Fitness
- Automotive
- Measurement testers
- Cyber security for critical applications in the aerospace
