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M2S060-FGG484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S060-FGG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 160
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Its package is 484-BGA.With 64KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series SmartFusion?2.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.267 I/Os are available in this SoC part.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.There are 484 terminations in total and that really benefits system on a chip.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.Using this SoC chip, you have the option of having 267 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 267 inputs for the user to choose from.A logic SoC has 56520 logic cells.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060-FGG484 System On Chip (SoC) applications.

  • Mobile market
  • Level
  • Measurement testers
  • Servo drive control module
  • Wireless networking
  • Deep learning hardware
  • Functional safety for critical applications in the industrial sectors
  • Central alarm system
  • DC-input BLDC motor drive
  • Remote control

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