M2S060T-1FCS325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 200 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.At least 1.14V can be supplied as a power source.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.The system on a chip uses 325 terminations in total.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 200 outputs, which is convenient.A power supply of 1.2V is required.A SoC chip with 200 inputs is available to the user.System on chips of logic are comprised of 56520 logic cells.As for its flash size, it is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060T-1FCS325 System On Chip (SoC) applications.
- ARM Cortex M4 microcontroller
- Efficient hardware for inference of neural networks
- Digital Media
- Vending machines
- Industrial AC-DC
- Apple smart watch
- Optical drive
- Microcontroller
- Functional safety for critical applications in the industrial sectors
- Mouse
