Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
325-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
325 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B325 |
Number of Outputs |
200 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
200 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
200 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 60K Logic Modules |
Number of Logic Cells |
56520 |
Flash Size |
256KB |
Height Seated (Max) |
1.01mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.In addition, this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 200 inputs and outputs.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.In order to run it, it must be fed by at least 1.14V of power.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.There are 325 terminations in total and that really benefits system on a chip.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 200 outputs.System on chip requires 1.2V power supplies.The SoC chip is equipped with 200 inputs.56520 logic cells are included in logic system on chips.This flash has a size of 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060T-1FCSG325 System On Chip (SoC) applications.
- Efficient hardware for training of neural networks
- Keywords
- Vending machines
- Communication network-on-Chip (cNoC)
- Measurement testers
- Special Issue Information
- Mouse
- Healthcare
- Automated sorting equipment
- CNC control