M2S060T-1FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines FPGA - 60K Logic Modules and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.200 I/Os are available in this SoC part.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.The system on a chip uses 325 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.It is possible to use this SoC chip with 200 outputs.A power supply of 1.2V is required.A SoC chip with 200 inputs is available.The logic system on chips contain 56520 logic cells.It has a 256KB flash.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060T-1FCSG325I System On Chip (SoC) applications.
- Central alarm system
- Transmitters
- Industrial Pressure
- Body control module
- Automated sorting equipment
- Mouse
- Smartphones
- Industrial AC-DC
- Defense
- Special Issue Editors
