M2S060T-1FG676
| Parameters | |
|---|---|
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 676-BGA by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.This SoC security combines FPGA - 60K Logic Modules and that is something to note.An advanced Tray package houses this SoC system on a chip.387 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.system on a chip benefits from 676 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 387 outputs is available.System on chip requires 1.2V power supplies.A SoC chip with 387 inputs is available to the user.Logic system on chips features 56520 logic cells.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FG676 System On Chip (SoC) applications.
- Embedded systems
- Industrial automation devices
- Smart appliances
- Efficient hardware for training of neural networks
- Sports
- Automotive
- Cyberphysical system-on-chip
- ARM processors
- External USB hard disk/SSD
- Three phase UPS
