M2S060T-1FG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 387.A 1.2V power supply is recommended.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, which makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 387 outputs.A power supply of 1.2V is required.This SoC chip is equipped with 387 inputs for the user to choose from.Logic system on chips features 56520 logic cells.As for its flash size, it is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FG676I System On Chip (SoC) applications.
- sequence controllers
- Vending machines
- ARM Cortex M4 microcontroller
- Sports
- Central inverter
- Automated sorting equipment
- Central alarm system
- Industrial automation devices
- Cyberphysical system-on-chip
- Networked sensors
