M2S060T-FCS325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.In addition, this SoC security combines FPGA - 60K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.In total, this SoC part has 200 I/Os.A 1.2V power supply is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.It is really beneficial to have system on a chip since there are 325 terminations in total.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.It is possible to use this SoC chip with 200 outputs.In order to use system on chip, you will need a power supply of 1.2V.200 inputs are available on the SoC chip.A logic SoC has 56520 logic cells.The flash size of the SoC meaning is 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060T-FCS325I System On Chip (SoC) applications.
- Servo drive control module
- CNC control
- sequence controllers
- USB hard disk enclosure
- External USB hard disk/SSD
- AC-input BLDC motor drive
- Industrial automation devices
- Transmitters
- Mouse
- Cyberphysical system-on-chip
