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M2S060TS-1FG676

676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S060TS-1FG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 117
  • Description: 676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V (Kg)

Details

Tags

Parameters
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 387
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 387
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 387
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 676-BGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.In order to run it, it must be fed by at least 1.14V of power.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.The system on a chip uses 676 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.There is 1.2V power supply required for system on chip.A SoC chip with 387 inputs is available to the user.56520 logic cells are present in logic system on chips.A 256KB flash can be seen on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-1FG676 System On Chip (SoC) applications.

  • Microprocessors
  • Transmitters
  • Special Issue Editors
  • CNC control
  • ARM
  • AC drive control module
  • Central alarm system
  • Medical
  • Communication interfaces ( I2C, SPI )
  • Measurement tools

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