Parameters |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
676 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B676 |
Number of Outputs |
387 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
387 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
387 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 60K Logic Modules |
Number of Logic Cells |
56520 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
Non-RoHS Compliant |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
676-BGA |
Surface Mount |
YES |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 676-BGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.In order to run it, it must be fed by at least 1.14V of power.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.The system on a chip uses 676 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.There is 1.2V power supply required for system on chip.A SoC chip with 387 inputs is available to the user.56520 logic cells are present in logic system on chips.A 256KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FG676 System On Chip (SoC) applications.
- Microprocessors
- Transmitters
- Special Issue Editors
- CNC control
- ARM
- AC drive control module
- Central alarm system
- Medical
- Communication interfaces ( I2C, SPI )
- Measurement tools