M2S060TS-1FG676I
| Parameters | |
|---|---|
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 676-BGA by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.This SoC security combines FPGA - 60K Logic Modules and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.387 I/Os are included in this SoC part.It is advised to utilize a 1.2V power supply.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is really beneficial to have system on a chip since there are 676 terminations in total.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 387 outputs is available.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip is equipped with 387 inputs for the user to choose from.The logic SoC features 56520 logic cells.There is a flash of 256KB on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FG676I System On Chip (SoC) applications.
- Level
- Remote control
- Sports
- Temperature
- Flow Sensors
- Functional safety for critical applications in the industrial sectors
- PC peripherals
- Healthcare
- Medical Pressure
- Wireless sensor networks
