Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
484-BGA |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Series |
SmartFusion®2 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 60K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.It is important to note that this SoC security combines FPGA - 60K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 267 I/Os in total.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG484 System On Chip (SoC) applications.
- Three phase UPS
- AC-input BLDC motor drive
- Central alarm system
- Industrial sectors
- Wireless networking
- POS Terminals
- Defense
- Special Issue Information
- Industrial AC-DC
- Apple smart watch