Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 60K Logic Modules |
Number of Logic Cells |
56520 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.This SoC part has a total of 267 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.There is no safe voltage for the SoCs wireless above 1.26V.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.It is really beneficial to have system on a chip since there are 484 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.It is possible to use this SoC chip with 267 outputs.There is 1.2V power supply required for system on chip.There are 267 inputs available on the SoC chip.Logic system on chips features 56520 logic cells.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG484I System On Chip (SoC) applications.
- Test and Measurement
- Wireless networking
- Smartphone accessories
- Industrial
- Servo drive control module
- Avionics
- Communication network-on-Chip (cNoC)
- Temperature Sensors
- Fitness
- Industrial sectors