Parameters |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 60K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
484-BGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tray |
Series |
Automotive, AEC-Q100, SmartFusion®2 |
Pbfree Code |
yes |
Part Status |
Active |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 484-BGA is assigned to this system on a chip by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.A system on chip SoC of this type belongs to the Automotive, AEC-Q100, SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 60K Logic Modules together.Housed in the state-of-art Tray package.This SoC part contains a total of 267 I/Os in total.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG484T2 System On Chip (SoC) applications.
- ARM
- Temperature
- Transmitters
- Personal Computers
- Functional safety for critical applications in the industrial sectors
- Temperature Sensors
- Avionics
- RISC-V
- Special Issue Editors
- CNC control