M2S060TS-1FGG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.Manufacturer assigns package 676-BGA to this system on a chip.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 387 I/Os.A power supply with a 1.2V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.It can feed on a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.There are 676 terminations in total and that really benefits system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.As far as power supplies are concerned, system on chip requires 1.2V.387 inputs are available on the SoC chip.System on chips of logic are comprised of 56520 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG676 System On Chip (SoC) applications.
- AC drive control module
- Measurement tools
- Three phase UPS
- External USB hard disk/SSD
- Communication interfaces ( I2C, SPI )
- Servo drive control module
- Microcontroller based SoC ( RISC-V, ARM)
- Special Issue Information
- Smartphones
- sequence controllers
