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M2S060TS-1VFG400T2

-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 207 I/O


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S060TS-1VFG400T2
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 776
  • Description: -40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 207 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 400-LFBGA
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Automotive, AEC-Q100, SmartFusion®2
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Flash Size 256KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.Its package is 400-LFBGA.A 64KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Automotive, AEC-Q100, SmartFusion?2 series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~125°C TJ.Taking note of the fact that this SoC security combines FPGA - 60K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 207 I/Os.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A 256KB flash can be seen on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-1VFG400T2 System On Chip (SoC) applications.

  • Smart appliances
  • USB hard disk enclosure
  • Industrial automation devices
  • Functional safety for critical applications in the aerospace
  • Print Special Issue Flyer
  • External USB hard disk/SSD
  • Sensor network-on-chip (sNoC)
  • Body control module
  • Cyberphysical system-on-chip
  • Microprocessors

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