M2S060TS-FCS325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.A 1.2V power supply is recommended.There is no safe voltage for the SoCs wireless above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.A system on a chip benefits from having 325 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There are 200 outputs available on this SoC.A power supply of 1.2V is required.There are 200 inputs available on the SoC chip.56520 logic cells are present in logic system on chips.This flash has a size of 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060TS-FCS325I System On Chip (SoC) applications.
- PC peripherals
- Cyber security for critical applications in the aerospace
- Measurement testers
- POS Terminals
- Communication network-on-Chip (cNoC)
- Video Imaging
- Industrial AC-DC
- Networked Media Encode/Decode
- Medical Pressure
- Personal Computers
