M2S060TS-FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion?2 is the series name of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 60K Logic Modules together.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 200.Use a power supply with a voltage of 1.2V if possible.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 325 terminations, which is great for system on a chip.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.You can have 200 user outputs for this SoC chip.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 200 inputs is available.There are 56520 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060TS-FCSG325I System On Chip (SoC) applications.
- ARM support modules
- Embedded systems
- USB hard disk enclosure
- Servo drive control module
- Automotive
- Central inverter
- System-on-chip (SoC)
- Print Special Issue Flyer
- External USB hard disk/SSD
- sequence controllers
