M2S060TS-FG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 676-BGA is assigned to this system on a chip by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 676 terminations, which is great for system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.This SoC chip is capable of having 387 outputs, which is convenient.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 387 inputs is available to the user.56520 logic cells are present in logic system on chips.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-FG676I System On Chip (SoC) applications.
- Microcontroller
- Central inverter
- Industrial robot
- Self-aware system-on-chip (SoC)
- Multiprocessor system-on-chips (MPSoCs)
- Automated sorting equipment
- Robotics
- Smartphones
- Mouse
- ARM
