M2S060TS-FGG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 676-BGA to this system on a chip.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.Housed in the state-of-art Tray package.This SoC part has a total of 387 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.The system on a chip uses 676 terminations in total.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There is the option to have 387 outputs on this SoC chip.In order to operate system on chip, you will need 1.2V power supplies.On the SoC chip, there are 387 inputs available for use.The logic system on chips contain 56520 logic cells.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-FGG676 System On Chip (SoC) applications.
- Microcontroller
- Smart appliances
- Networked Media Encode/Decode
- Medical Pressure
- Communication interfaces ( I2C, SPI )
- PC peripherals
- Robotics
- Smartphone accessories
- Industrial
- Deep learning hardware
