M2S060TS-FGG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Its package is 676-BGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines FPGA - 60K Logic Modules together.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part includes 387 I/Os.It is advised to utilize a 1.2V power supply.There is no safe voltage for the SoCs wireless above 1.26V.At least 1.14V can be supplied as a power source.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In total, there are 676 terminations, which is great for system on a chip.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.A SoC chip like this can have 387 outputs.There is 1.2V power supply required for system on chip.The SoC chip is equipped with 387 inputs.System on chips of logic are comprised of 56520 logic cells.There is a flash of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-FGG676I System On Chip (SoC) applications.
- ARM Cortex M4 microcontroller
- Apple smart watch
- Mobile computing
- Servo drive control module
- Personal Computers
- Efficient hardware for inference of neural networks
- DC-input BLDC motor drive
- Samsung galaxy gear
- System-on-chip (SoC)
- Measurement testers
