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M2S060TS-VF400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S060TS-VF400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 353
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Package 400-LFBGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.207 I/Os are included in this SoC part.A 1.2V power supply is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.A system on a chip benefits from having 400 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.There is the option to have 207 outputs on this SoC chip.System on chip requires 1.2V power supplies.A SoC chip with 207 inputs is available.There are 56520 logic cells in the logic system on chips.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-VF400I System On Chip (SoC) applications.

  • USB hard disk enclosure
  • RISC-V
  • Automated sorting equipment
  • Functional safety for critical applications in the automotive
  • Medical
  • Mouse
  • Microcontroller based SoC ( RISC-V, ARM)
  • Networked Media Encode/Decode
  • Industrial automation devices
  • Communication interfaces ( I2C, SPI )

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