M2S090-1FCS325I
| Parameters | |
|---|---|
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.Its package is 325-TFBGA, CSPBGA.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.In addition, this SoC security combines FPGA - 90K Logic Modules.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 180 I/Os.It is recommended to use a 1.2V power supply.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.The system on a chip uses 325 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.Using this SoC chip, you have the option of having 180 outputs.This system on chip SoC requires 1.2V power supply at all.This SoC chip is equipped with 180 inputs for the user to choose from.Logic system on chips consist of 86316 logic cells.A flashing 512KB appears on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-1FCS325I System On Chip (SoC) applications.
- Mobile computing
- High-end PLC
- Functional safety for critical applications in the automotive
- Robotics
- Networked sensors
- Vending machines
- Apple smart watch
- Industrial sectors
- Industrial automation devices
- Vending machines
