M2S090-1FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Number of Pins | 325 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Speed Grade | 1 |
| Primary Attributes | FPGA - 90K Logic Modules |
| Flash Size | 512KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 180 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 325 terminations, which makes system on a chip possible.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 180 outputs.As for its flash size, it is 512KB.Further features of this SoC processor are LG-MIN, WD-MIN.This is the version with 325 pins.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-1FCSG325I System On Chip (SoC) applications.
- Sports
- Smart appliances
- Central alarm system
- Microcontroller
- Measurement tools
- Special Issue Editors
- Apple smart watch
- Wireless networking
- Robotics
- Vending machines
