Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Frequency |
166MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
M2S090 |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Interface |
CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of I/O |
267 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
FPGA - 90K Logic Modules |
Number of Logic Cells |
86316 |
Flash Size |
512KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.A MCU, FPGA technique is used for the SoC design's internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.267 I/Os are available in this SoC part.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.Power supply should be at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.system on a chip benefits from 484 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.You can have 267 user outputs for this SoC chip.In order to use system on chip, you will need a power supply of 1.2V.Inputs are available on the SoC chip in the number of 267.System on chips of logic are comprised of 86316 logic cells.A flashing 512KB appears on it.Search M2S090 for system on chips with similar specs and purposes.At 166MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-1FG484I System On Chip (SoC) applications.
- Functional safety for critical applications in the industrial sectors
- Networked sensors
- Optical drive
- AC drive control module
- Test and Measurement
- Central alarm system
- Servo drive control module
- Functional safety for critical applications in the aerospace
- CNC control
- PC peripherals