M2S090-1FG676IX417
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | SmartFusion®2 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 425 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 90K Logic Modules |
| Flash Size | 512KB |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 676-BGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 425 I/Os.There is a flash of 512KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S090-1FG676IX417 System On Chip (SoC) applications.
- Industrial automation devices
- Efficient hardware for training of neural networks
- Robotics
- Flow Sensors
- Automated sorting equipment
- Robotics
- Body control module
- Efficient hardware for inference of neural networks
- POS Terminals
- Measurement tools
