M2S090-1FGG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S090 |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 425 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 425 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 425 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Its package is 676-BGA.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 90K Logic Modules together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 425 I/Os.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.A system on a chip benefits from having 676 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There is the option to have 425 outputs on this SoC chip.There is 1.2V power supply requirement for this system on chip SoC.425 inputs are available on the SoC chip.The logic SoC features 86316 logic cells.The flash size of the SoC meaning is 512KB.You can get system on chips with similar specs and purposes by searching M2S090.166MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-1FGG676 System On Chip (SoC) applications.
- Keyboard
- POS Terminals
- Sensor network-on-chip (sNoC)
- Industrial transport
- Wireless networking
- Body control module
- Smartphone accessories
- Automotive gateway
- Healthcare
- Networked sensors
