M2S090-1FGG676I
| Parameters | |
|---|---|
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S090 |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 425 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 425 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 425 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 676-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.In addition, this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 425.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 676 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 425 inputs is available to the user.The logic SoC features 86316 logic cells.As for its flash size, it is 512KB.M2S090 will give you system on chips with similar specifications and purposes.It operates at a frequency of 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-1FGG676I System On Chip (SoC) applications.
- Networked sensors
- Functional safety for critical applications in the aerospace
- Functional safety for critical applications in the industrial sectors
- System-on-chip (SoC)
- Flow Sensors
- Industrial Pressure
- Industrial automation devices
- Test and Measurement
- DC-input BLDC motor drive
- String inverter
