M2S090-FCS325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.Its package is 325-TFBGA, CSPBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.There is one thing to note about this SoC security: it combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.180 I/Os are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.In total, there are 325 terminations, which is great for system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.This SoC chip is capable of having 180 outputs, which is convenient.There is 1.2V power supply required for system on chip.The SoC chip offers 180 inputs.86316 logic cells are present in logic system on chips.This flash has a size of 512KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-FCS325 System On Chip (SoC) applications.
- Mobile computing
- External USB hard disk/SSD
- Medical
- Temperature Sensors
- Apple smart watch
- Mobile market
- Robotics
- Functional safety for critical applications in the automotive
- Multiprocessor system-on-chips (MPSoCs)
- Networked sensors
