M2S090T-1FCS325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 90K Logic Modules together.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 180 inputs and outputs.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, voltages above 1.26V are considered unsafe.It can feed on a power supply of at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Having 325 terminations in total makes system on a chip possible.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.You can have 180 user outputs for this SoC chip.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip is equipped with 180 inputs.In logic system on chips, there are 86316 logic cells.The flash is set to 512KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090T-1FCS325 System On Chip (SoC) applications.
- Measurement tools
- Defense
- Flow Sensors
- Test and Measurement
- Smartphones
- Automated sorting equipment
- String inverter
- Industrial sectors
- Communication interfaces ( I2C, SPI )
- System-on-chip (SoC)
