M2S090T-1FCSG325
| Parameters | |
|---|---|
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the SmartFusion?2 series of system on a chips.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 90K Logic Modules and that is something to note.An advanced Tray package houses this SoC system on a chip.This SoC part contains a total of 180 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 325 terminations.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 180 outputs, which is convenient.A power supply of 1.2V is required.The SoC chip offers 180 inputs.System on chips of logic are comprised of 86316 logic cells.This flash has a size of 512KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090T-1FCSG325 System On Chip (SoC) applications.
- Medical Pressure
- AC drive control module
- Medical
- Deep learning hardware
- Sports
- Multiprocessor system-on-chips (MPSoCs)
- Mobile market
- Smart appliances
- Functional safety for critical applications in the industrial sectors
- ARM
