M2S090T-1FG484M
| Parameters | |
|---|---|
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 484-BGA |
| Surface Mount | YES |
| Operating Temperature | -55°C~125°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | 3A001.A.2.C |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 267 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 267 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 267 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -55°C~125°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 267 inputs and outputs.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.In the SoCs wireless, voltages above 1.26V are considered unsafe.There is a possibility that it can be powered by a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 484 terminations, which is great for system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 267 outputs.As far as power supplies are concerned, system on chip requires 1.2V.This SoC chip is equipped with 267 inputs for the user to choose from.The logic system on chips contain 86316 logic cells.A flashing 512KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S090T-1FG484M System On Chip (SoC) applications.
- Test and Measurement
- ARM
- High-end PLC
- Efficient hardware for inference of neural networks
- Flow Sensors
- Digital Signal Processing
- DC-input BLDC motor drive
- Industrial transport
- Temperature Sensors
- Apple smart watch
