Parameters |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Frequency |
166MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
M2S090T |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Interface |
CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of I/O |
267 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
FPGA - 90K Logic Modules |
Number of Logic Cells |
86316 |
Flash Size |
512KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
RoHS Compliant |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.A key point to note is that this SoC security combines FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.This SoC part has a total of 267 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.Power supply should be at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 484 terminations, which is great for system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There is the option to have 267 outputs on this SoC chip.A power supply of 1.2V is required to run system on chip.267 inputs are available on the SoC chip.Logic system on chips consist of 86316 logic cells.The flash is set to 512KB.M2S090T can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090T-1FGG484 System On Chip (SoC) applications.
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