M2S090T-1FGG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S090T |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 425 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 425 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 425 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 676-BGA, this system on a chip comes from the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.The average operating temps for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 425 I/Os.A 1.2V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.A system on a chip benefits from having 676 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.The SoC chip that comes with this module can be configured to have 425 outputs.A power supply of 1.2V is required to run system on chip.425 inputs are available on the SoC chip.86316 logic cells are included in logic system on chips.As for its flash size, it is 512KB.By searching M2S090T, you can find system on chips with similar specs and purposes.It operates at a frequency of 166MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090T-1FGG676 System On Chip (SoC) applications.
- Functional safety for critical applications in the industrial sectors
- Level
- Digital Signal Processing
- Industrial sectors
- Samsung galaxy gear
- Remote control
- Personal Computers
- Measurement testers
- USB hard disk enclosure
- Automotive
