Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Frequency |
166MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
M2S090T |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Interface |
CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of I/O |
267 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
FPGA - 90K Logic Modules |
Number of Logic Cells |
86316 |
Flash Size |
512KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is part of the SmartFusion?2 series of system on a chips.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 90K Logic Modules.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 267 I/Os.A 1.2V power supply should be used.In the SoCs wireless, voltages above 1.26V are considered unsafe.It can feed on a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.A system on a chip benefits from having 484 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.Using this SoC chip, you have the option of having 267 outputs.There is 1.2V power supply required for system on chip.A SoC chip with 267 inputs is available.System on chips of logic are comprised of 86316 logic cells.A flashing 512KB appears on it.Search M2S090T for system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.In terms of core architecture, the SoC meaning relies on ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090T-FG484 System On Chip (SoC) applications.
- ARM
- ARM Cortex M4 microcontroller
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- Test and Measurement
- Measurement tools