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M2S090TS-1FCS325I

325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S090TS-1FCS325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 361
  • Description: 325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Number of Pins 325
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Outputs 180
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade 1
Primary Attributes FPGA - 90K Logic Modules
Flash Size 512KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.With 64KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is part of the SmartFusion?2 series of system on a chips.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.180 I/Os are included in this SoC part.It is advised to utilize a 1.2V power supply.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.As a result, there are 325 terminations in total, which does really benefit system on a chip.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip like this can have 180 outputs.The flash is set to 512KB.This SoC processor also includes LG-MIN, WD-MIN.This is the 325-pin version of the computer SoC.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S090TS-1FCS325I System On Chip (SoC) applications.

  • Defense
  • Functional safety for critical applications in the aerospace
  • DC-input BLDC motor drive
  • Smart appliances
  • Robotics
  • Special Issue Editors
  • Three phase UPS
  • AC drive control module
  • Mobile computing
  • Healthcare

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