Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
676-BGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
676 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B676 |
Number of Outputs |
425 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
425 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
425 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 90K Logic Modules |
Number of Logic Cells |
86316 |
Flash Size |
512KB |
Height Seated (Max) |
2.44mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 676-BGA by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 425 I/Os.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 676 terminations, so system on a chip is really aided by this.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.In order for this SoC chip to work properly, you can have 425 outputs.As far as power supplies are concerned, system on chip requires 1.2V.On the SoC chip, there are 425 inputs available for use.A logic SoC has 86316 logic cells.A flashing 512KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S090TS-1FG676 System On Chip (SoC) applications.
- Samsung galaxy gear
- Sensor network-on-chip (sNoC)
- Industrial automation devices
- String inverter
- Industrial automation devices
- Automated sorting equipment
- Flow Sensors
- Functional safety for critical applications in the automotive
- DC-input BLDC motor drive
- Networked sensors