M2S090TS-1FGG676T2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 676-BGA |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Series | Automotive, AEC-Q100, SmartFusion®2 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 425 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Flash Size | 512KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Manufacturer assigns package 676-BGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Automotive, AEC-Q100, SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 425 I/Os.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.It has a 512KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S090TS-1FGG676T2 System On Chip (SoC) applications.
- Networked sensors
- ARM
- Three phase UPS
- Sensor network-on-chip (sNoC)
- Measurement testers
- External USB hard disk/SSD
- Healthcare
- Defense
- Automotive
- Sports
