M2S090TS-FCS325I
| Parameters | |
|---|---|
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Internally, this SoC design uses the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 180 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supply should be at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.A system on a chip benefits from having 325 terminations.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.You can have 180 user outputs for this SoC chip.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 180 inputs is available to the user.The logic system on chips contain 86316 logic cells.It has a 512KB flash.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090TS-FCS325I System On Chip (SoC) applications.
- Special Issue Editors
- String inverter
- Servo drive control module
- ARM support modules
- Industrial Pressure
- Keywords
- Defense
- Central alarm system
- Vending machines
- Communication interfaces ( I2C, SPI )
