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M2S090TS-FG676I

676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S090TS-FG676I
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 479
  • Description: 676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

Details

Tags

Parameters
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 425
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 676-BGA package.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.As a whole, this SoC part is comprised of 425 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 676 terminations in total, which does really benefit system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.There is the option to have 425 outputs on this SoC chip.This system on chip SoC requires 1.2V power supply at all.On the SoC chip, there are 425 inputs available for use.The logic SoC features 86316 logic cells.A 512KB flash can be seen on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S090TS-FG676I System On Chip (SoC) applications.

  • Networked sensors
  • Wireless networking
  • Functional safety for critical applications in the automotive
  • Keywords
  • Networked Media Encode/Decode
  • Microprocessors
  • Smartphones
  • Multiprocessor system-on-chips (MPSoCs)
  • Robotics
  • Sensor network-on-chip (sNoC)

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