M2S100-1FC1152
| Parameters | |
|---|---|
| Package / Case | 1152-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Finish | TIN LEAD |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S100 |
| JESD-30 Code | S-PBGA-B1152 |
| Number of Outputs | 574 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 574 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 574 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 100K Logic Modules |
| Number of Logic Cells | 99512 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.9mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 100K Logic Modules.Tray package houses this SoC system on a chip.574 I/Os in total are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.As long as it receives a power supply that is at least 1.14V, it should be able to function.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.Using this SoC chip, you have the option of having 574 outputs.In order to operate system on chip, you will need 1.2V power supplies.On the SoC chip, there are 574 inputs available for use.99512 logic cells are present in logic system on chips.It has a 512KB flash.Searching M2S100 will yield system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100-1FC1152 System On Chip (SoC) applications.
- External USB hard disk/SSD
- Efficient hardware for training of neural networks
- Microprocessors
- AC-input BLDC motor drive
- Communication interfaces ( I2C, SPI )
- Three phase UPS
- Automotive gateway
- Industrial automation devices
- Microcontroller
- Industrial sectors
